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Description:
Fusion Ozone Asher 200AC
(Ozone Asher 200AC)
Fusion Ozone Asher 200AC
*Ozone Asher
*Dry chemical ashing to remove photoresist from semiconductor substrates
*No RF or uWave Plasma
*Dry chemical process
*Atmoshperic pressure
*Infinite substrate selectivity
*End point detection
*Fast ashing rates
*Low particulates
*Single wafer operation
*Cassette to cassette wafer handling 4" to 8"
*Wafer capability
*Modular system design
*Microprocessor control
*Ozone monitoring system
*System self diagnostics
*208V., 3Ph., 60Hz.
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